Job responsibilities:
- Collaborate and work in multidisciplinary team (electrical engineers, mechanical engineers, chemical engineers, etc.) for 3D sensor design and Hardware/Firmware integration and debug.
- Perform troubleshooting and root cause analyses for complex design issues.
- Participate in engineering design reviews, analyze design specifications, and understand electrical/mechanical constraints to design, and ensure cost effective designs.
- Design and test analog circuit design, Op-amp application, noise filtering and electrostatic discharge-safe circuitry for 3D sensors with EMC/EMI constrain. Performance analysis tuning optimization for sensor boards.
- Work collaboratively on multidisciplinary 3D sensor development projects (digital, analog, and power design in integrated circuits, processors, microprocessors, memory, and power circuits).
- Develop firmware, software (C, C++, Python etc.) and embedded Linux for ARM microprocessors that power the system with on-board communication protocols (I2C, SPI, UART, USB) and wireless protocols (Wi-Fi, GPS, BLE, ISM) with the knowledge of the limitations, constraints and performance issues associated with embedded firmware development.
- Work with BSP, device driver including 2-Lane/4-Lane MIPI 3D camera sensor, build embedded Linux kernel with Yocto toolset on ARM systems.
- Integrate signal processing and image processing algorithms in firmware based on ML technology.
- Design Electrical Schematic and PCB layout for manufacturing (DFM) and testing (DFT) High speed PCB Layout design with Transmission Line Theory; Perform bring-up board test; Perform H-Spice Simulation (by using Cadence Or CAD/Altium Designer); design mixed signal circuit.
- Draft technical writing for validation plans, procedures, and reports.
Job requirements:
Education Requirements: Must have a master degree in electrical engineering or a related field.
Must have 12 months experience working as an Electrical Engineer which include sensor designs; firmware, software and embedded Linux for ARM microprocessors; on-board communication protocols and wireless protocols, BSP device driver, PCB layout for manufacturing DFM; testing DFT, Cadence; CAD/Altium Designer. Please mail resumes to Qing Li, 2800 Livernois Road, Suite 220, Troy, MI 48083.
If you are instersted, please email your resume to:Qing Li at Orbbec 3D Technology International, Inc., 2800 Livernois Road, Suite 220, Troy, MI 48083